Service Details:
City/Location | Bhosari Pune |
Applications of Plating | Surface Protection |
Application Type | Industrial |
Duration | 4.-5 days |
Location | All over india |
Plating Methods | Manual Plating |
Types of Plating | Electroless plating |
Copper electroplating takes place in an electrolytic cell using electrolysis. As with all plating processes, the part to be plated must be cleaned before depositing metal to remove soils, grease, oxides, and defects.[4][5] After precleaning, the part is immersed in the cell's aqueous electrolyte solution and functions as the cathode. A copper anode is also immersed in the solution. During plating, a direct electric current is applied to the cell which causes the copper in the anode to dissolve into the electrolyte through oxidation, losing electrons and ionizing into copper cations. The copper cations form a coordination complex with salts present in the electrolyte, after which they are transported from the anode to the cathode. At the cathode, the copper ions are reduced to metallic copper by gaining electrons. This causes a thin, solid, metallic copper film to deposit onto the surface of the part.
The anodes can be either simple copper slabs or titanium or steel baskets filled with copper nuggets or balls.[6] The anodes may be placed in anode bags, which are typically made of polypropylene or another fabric and are used to contain insoluble particles that flake off the anode and prevent them from contaminating the plating bath.Copper electroplating baths can be used to plate either a strike or flash coating, which is a thin highly-adherent initial layer that is plated with additional layers of metal and that serves to improve adhesion of the subsequent layers to the underlying substrate, or a thicker coating of copper that may serve as the finish layer or as a standalone coating
Types of plating chemistries
There are a variety of different electrolyte chemistries that can be used for copper electroplating, but most can be broadly characterized into five general categories based on the complexing agent
Additional Information:
Service Details:
Service Location | Bhosari, Pune |
Service Location/City | Pune, Maharashtra |
Duration | 1-2 Days |
Types of Plating | Electroless plating |
Service Mode | Onsite |
Additional Information:
Service Details:
Minimum Order Quantity | 50 Square Inch |
Applications for Electroplating | Military Weaponry, Mechanical Assemblies, Medical Diagnostic Instruments, Tools and Dies |
Solutions Used | Copper and Sulfuric Acid |
Applications of Plating | Surface Protection |
Types of Electroplating | Rack Platting |
Duration | 2-4 Days |
Location | Pune,Maharashtra |
Plating Methods | Rack Plating Method |
Types of Plating | Immersion plating |
Copper electroplating takes place in an electrolytic cell using electrolysis. As with all plating processes, the part to be plated must be cleaned before depositing metal to remove soils, grease, oxides, and defects.[4][5] After precleaning, the part is immersed in the cell's aqueous electrolyte solution and functions as the cathode. A copper anode is also immersed in the solution. During plating, a direct electric current is applied to the cell which causes the copper in the anode to dissolve into the electrolyte through oxidation, losing electrons and ionizing into copper cations. The copper cations form a coordination complex with salts present in the electrolyte, after which they are transported from the anode to the cathode. At the cathode, the copper ions are reduced to metallic copper by gaining electrons. This causes a thin, solid, metallic copper film to deposit onto the surface of the part.
The anodes can be either simple copper slabs or titanium or steel baskets filled with copper nuggets or balls.[6] The anodes may be placed in anode bags, which are typically made of polypropylene or another fabric and are used to contain insoluble particles that flake off the anode and prevent them from contaminating the plating bath.Copper electroplating baths can be used to plate either a strike or flash coating, which is a thin highly-adherent initial layer that is plated with additional layers of metal and that serves to improve adhesion of the subsequent layers to the underlying substrate, or a thicker coating of copper that may serve as the finish layer or as a standalone coating
Types of plating chemistries
There are a variety of different electrolyte chemistries that can be used for copper electroplating, but most can be broadly characterized into five general categories based on the complexing agent
Service Details:
Minimum Order Quantity | 5 Square Inch |
Service Location | Bhosari , Pune |
Metals | Copper |
Location | Pune, Maharashtra |
Duration | 2-3 days |
Service Mode | Offline |
Copper electroplating takes place in an electrolytic cell using electrolysis. As with all plating processes, the part to be plated must be cleaned before depositing metal to remove soils, grease, oxides, and defects.[4][5] After precleaning, the part is immersed in the cell's aqueous electrolyte solution and functions as the cathode. A copper anode is also immersed in the solution. During plating, a direct electric current is applied to the cell which causes the copper in the anode to dissolve into the electrolyte through oxidation, losing electrons and ionizing into copper cations. The copper cations form a coordination complex with salts present in the electrolyte, after which they are transported from the anode to the cathode. At the cathode, the copper ions are reduced to metallic copper by gaining electrons. This causes a thin, solid, metallic copper film to deposit onto the surface of the part.
The anodes can be either simple copper slabs or titanium or steel baskets filled with copper nuggets or balls.[6] The anodes may be placed in anode bags, which are typically made of polypropylene or another fabric and are used to contain insoluble particles that flake off the anode and prevent them from contaminating the plating bath.Copper electroplating baths can be used to plate either a strike or flash coating, which is a thin highly-adherent initial layer that is plated with additional layers of metal and that serves to improve adhesion of the subsequent layers to the underlying substrate, or a thicker coating of copper that may serve as the finish layer or as a standalone coating
Types of plating chemistries
There are a variety of different electrolyte chemistries that can be used for copper electroplating, but most can be broadly characterized into five general categories based on the complexing agent
Additional Information:
Service Details:
Applications of Plating | Alloy Metal Plating |
Duration | 2-3 days |
Location | Bhosari pune |
Plating Methods | Barrel Plating |
Types of Plating | Electroplating |
Copper electroplating is the process of electroplating a layer of copper onto the surface of a metal object. Copper is used both as a standalone coating and as an undercoat onto which other metals are subsequently plated. The copper layer can be decorative, provide corrosion resistance, increase electrical and thermal conductivity, or improve the adhesion of additional deposits to the substrate
We are offering a large collection of Copper Electroplating Service. Our offered service is used for imparting the properties of copper on metal surfaces. Apart from this, the offered array of services is rendered using high-quality input factors and latest technology.
Other Details:
Copper electroplating takes place in an electrolytic cell using electrolysis. As with all plating processes, the part to be plated must be cleaned before depositing metal to remove soils, grease, oxides, and defects.[4][5] After precleaning, the part is immersed in the cell's aqueous electrolyte solution and functions as the cathode. A copper anode is also immersed in the solution. During plating, a direct electric current is applied to the cell which causes the copper in the anode to dissolve into the electrolyte through oxidation, losing electrons and ionizing into copper cations. The copper cations form a coordination complex with salts present in the electrolyte, after which they are transported from the anode to the cathode. At the cathode, the copper ions are reduced to metallic copper by gaining electrons. This causes a thin, solid, metallic copper film to deposit onto the surface of the part.The anodes can be either simple copper slabs or titanium or steel baskets filled with copper nuggets or balls.[6] The anodes may be placed in anode bags, which are typically made of polypropylene or another fabric and are used to contain insoluble particles that flake off the anode and prevent them from contaminating the plating bath.Copper electroplating baths can be used to plate either a strike or flash coating, which is a thin highly-adherent initial layer that is plated with additional layers of metal and that serves to improve adhesion of the subsequent layers to the underlying substrate, or a thicker coating of copper that may serve as the finish layer or as a standalone coating
Types of plating chemistries
There are a variety of different electrolyte chemistries that can be used for copper electroplating, but most can be broadly characterized into five general categories based on the complexing agent
Decorative copper electroplating takes advantage of the high levelling power of copper bath formulations that produce bright deposits, the ability of copper to cover defects in the base metal, and the softness of copper that makes it easy to buff and polish for a glossy finish. While copper may be used as the final decorative surface layer, it is usually subsequently plated with other metals that are more resistant to wear or tarnish such as chromium, nickel, or gold; in this case, the brightness of the copper undercoat enhances the appearance of the subsequent finish layer. Products that utilize decorative copper plating include automotive trim, furniture, door and cabinet handles, light fixtures, kitchen utensils, other household goods, and apparel
Additional Information:
Service Details:
Minimum Order Quantity | 1 Square Inch |
Service Location | Bhosari, Pune |
Service Location/City | Pune, Maharashtra |
Location | Bhosari midc |
Plating Methods | Barrel Plating |
Types of Plating | Electroplating |
Copper electroplating takes place in an electrolytic cell using electrolysis. As with all plating processes, the part to be plated must be cleaned before depositing metal to remove soils, grease, oxides, and defects.[4][5] After precleaning, the part is immersed in the cell's aqueous electrolyte solution and functions as the cathode. A copper anode is also immersed in the solution. During plating, a direct electric current is applied to the cell which causes the copper in the anode to dissolve into the electrolyte through oxidation, losing electrons and ionizing into copper cations. The copper cations form a coordination complex with salts present in the electrolyte, after which they are transported from the anode to the cathode. At the cathode, the copper ions are reduced to metallic copper by gaining electrons. This causes a thin, solid, metallic copper film to deposit onto the surface of the part.
The anodes can be either simple copper slabs or titanium or steel baskets filled with copper nuggets or balls.[6] The anodes may be placed in anode bags, which are typically made of polypropylene or another fabric and are used to contain insoluble particles that flake off the anode and prevent them from contaminating the plating bath.Copper electroplating baths can be used to plate either a strike or flash coating, which is a thin highly-adherent initial layer that is plated with additional layers of metal and that serves to improve adhesion of the subsequent layers to the underlying substrate, or a thicker coating of copper that may serve as the finish layer or as a standalone coating
Types of plating chemistries
There are a variety of different electrolyte chemistries that can be used for copper electroplating, but most can be broadly characterized into five general categories based on the complexing agent
Additional Information:
Service Details:
Minimum Order Quantity | 50 Square Inch |
Applications of Plating | Decorative Coatings |
Solutions Used | Copper and Sulfuric Acid |
Types of Electroplating | Rack Platting |
Type Of Copper Electroplating | Alkaline |
Location | Bhosari midc pune |
Plating Methods | Rack Plating Method |
Types of Plating | Electroless plating |
Copper electroplating takes place in an electrolytic cell using electrolysis. As with all plating processes, the part to be plated must be cleaned before depositing metal to remove soils, grease, oxides, and defects.[4][5] After precleaning, the part is immersed in the cell's aqueous electrolyte solution and functions as the cathode. A copper anode is also immersed in the solution. During plating, a direct electric current is applied to the cell which causes the copper in the anode to dissolve into the electrolyte through oxidation, losing electrons and ionizing into copper cations. The copper cations form a coordination complex with salts present in the electrolyte, after which they are transported from the anode to the cathode. At the cathode, the copper ions are reduced to metallic copper by gaining electrons. This causes a thin, solid, metallic copper film to deposit onto the surface of the part.
The anodes can be either simple copper slabs or titanium or steel baskets filled with copper nuggets or balls.[6] The anodes may be placed in anode bags, which are typically made of polypropylene or another fabric and are used to contain insoluble particles that flake off the anode and prevent them from contaminating the plating bath.Copper electroplating baths can be used to plate either a strike or flash coating, which is a thin highly-adherent initial layer that is plated with additional layers of metal and that serves to improve adhesion of the subsequent layers to the underlying substrate, or a thicker coating of copper that may serve as the finish layer or as a standalone coating
Types of plating chemistries
There are a variety of different electrolyte chemistries that can be used for copper electroplating, but most can be broadly characterized into five general categories based on the complexing agent
Service Details:
Industries Served | Semi-conductor |
Applications Of Plating | Engineering Coatings, Decorative Coatings, Surface Protection |
Location | J-347, J block, MIDC, Bhosari, pune |
Plating Methods | Manual Plating |
Types Of Plating | Electroplating |
Also Provides | Chrome Electroplating, Buffing Service, Plating Service |
Copper electroplating takes place in an electrolytic cell using electrolysis. As with all plating processes, the part to be plated must be cleaned before depositing metal to remove soils, grease, oxides, and defects.[4][5] After precleaning, the part is immersed in the cell's aqueous electrolyte solution and functions as the cathode. A copper anode is also immersed in the solution. During plating, a direct electric current is applied to the cell which causes the copper in the anode to dissolve into the electrolyte through oxidation, losing electrons and ionizing into copper cations. The copper cations form a coordination complex with salts present in the electrolyte, after which they are transported from the anode to the cathode. At the cathode, the copper ions are reduced to metallic copper by gaining electrons. This causes a thin, solid, metallic copper film to deposit onto the surface of the part.
The anodes can be either simple copper slabs or titanium or steel baskets filled with copper nuggets or balls.[6] The anodes may be placed in anode bags, which are typically made of polypropylene or another fabric and are used to contain insoluble particles that flake off the anode and prevent them from contaminating the plating bath.Copper electroplating baths can be used to plate either a strike or flash coating, which is a thin highly-adherent initial layer that is plated with additional layers of metal and that serves to improve adhesion of the subsequent layers to the underlying substrate, or a thicker coating of copper that may serve as the finish layer or as a standalone coating
Types of plating chemistries
There are a variety of different electrolyte chemistries that can be used for copper electroplating, but most can be broadly characterized into five general categories based on the complexing agent
Additional Information:
Service Details:
Service Location | Bhosari, Pune |
Applications Of Plating | Engineering Coatings, Surface Protection, Decorative Coatings |
Location | J-347, J block, MIDC, Bhosari, pune-26 |
Plating Methods | Manual Plating |
Types Of Plating | Electroplating |
Also Provides | Brass Plating, Plating Service, Nickel Plating |
Copper electroplating takes place in an electrolytic cell using electrolysis. As with all plating processes, the part to be plated must be cleaned before depositing metal to remove soils, grease, oxides, and defects.[4][5] After precleaning, the part is immersed in the cell's aqueous electrolyte solution and functions as the cathode. A copper anode is also immersed in the solution. During plating, a direct electric current is applied to the cell which causes the copper in the anode to dissolve into the electrolyte through oxidation, losing electrons and ionizing into copper cations. The copper cations form a coordination complex with salts present in the electrolyte, after which they are transported from the anode to the cathode. At the cathode, the copper ions are reduced to metallic copper by gaining electrons. This causes a thin, solid, metallic copper film to deposit onto the surface of the part.
The anodes can be either simple copper slabs or titanium or steel baskets filled with copper nuggets or balls.[6] The anodes may be placed in anode bags, which are typically made of polypropylene or another fabric and are used to contain insoluble particles that flake off the anode and prevent them from contaminating the plating bath.Copper electroplating baths can be used to plate either a strike or flash coating, which is a thin highly-adherent initial layer that is plated with additional layers of metal and that serves to improve adhesion of the subsequent layers to the underlying substrate, or a thicker coating of copper that may serve as the finish layer or as a standalone coating
Types of plating chemistries
There are a variety of different electrolyte chemistries that can be used for copper electroplating, but most can be broadly characterized into five general categories based on the complexing agent
Additional Information: